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Basic SMT Process Flow

2025-09-19

Basic SMT Process Flow

The Process and Characteristics of Surface Mount Technology (SMT)#
SMT (Surface Mount Technology) is an abbreviation or abbreviation for Surface Mount Technology, which refers to the process of attaching Surface Mount Devices (SMD) onto the surface of PCB (or other substrate) through certain processes, equipment, and materials, and then soldering, cleaning, and testing to finally complete the assembly.

Simply put, SMT refers to surface mount technology, while SMD refers to surface mount components.

Single sided full surface assembly process:
Printing solder paste - mounting components - reflow soldering - cleaning

Double sided full surface assembly process:
Printing solder paste - mounting components - reflow soldering - flipping board - printing solder paste - mounting components - reflow soldering - cleaning

Double sided hybrid assembly process:
Printing solder paste - mounting components - reflow soldering - flipping board - dot patch adhesive - mounting components - curing - flipping board - inserting components - wave crossing - cleaning

Single sided mixed assembly process:

Spot mount adhesive - Component mounting - Curing - Flip board - Component insertion - Wave soldering - Cleaning

The SMT process is related to both soldering and assembly methods, as follows:

According to the welding method, it can be divided into two types: reflow soldering and wave soldering.

According to the assembly method, it can be divided into three types: full surface assembly, single-sided mixed assembly, and double-sided mixed assembly.

The main factors affecting welding quality include PCB design, quality of solder (Sn63/Pb37), quality of flux, degree of oxidation on the surface of the welded metal (component solder ends, PCB solder ends), process: printing, pasting, soldering (correct temperature curve), equipment, and management.

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