Wysokiej Precyzji Urządzenia Opakowaniowe Półprzewodnikowe

Adres: 301A, Bldg. D, nr 50, Nanhuan Road, Shiwei Community, Matian Street, Guangming District, Shenzhen, Guangdong, Chiny
Tel: 86-18823383970-8:30-17:30
Faks: 86-18823383970
Wiadomość e-mail: wenzhanhucai@163.com
Czas pracy: 8:30-17:30

Name: Wysokiej precyzji urządzenia opakowaniowe półprzewodnikowe
Uploaded: 2026-02-07CST01:59:28-06:00
Duration: 38 s
Description: Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.

Grupa: Inne filmy

Czas wydania: 2025-04-24

Słowo kluczowe: Wyposażenie linii SMT

Opis wideo

Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.