Wysokiej Precyzji Urządzenia Opakowaniowe Półprzewodnikowe
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Discover the High Precision Semiconductor Packaging Equipment LED Die Bonder Die Bonding Machine, designed for exceptional accuracy and efficiency in semiconductor packaging. This machine features a solid crystal cycle of >40 ms, die bonding position accuracy of ±0.3 mil, and advanced imaging systems for precise operations. Ideal for high-precision LED die bonding applications.
Produkt prezentowany w tym filmie
- Solid crystal cycle of >40 ms ensures rapid processing.
- Die bonding position accuracy of ±0.3 mil for high precision.
- Dispensing heating with constant temperature control.
- High-resolution imaging system with 256 gray scale identification.
- Wafer stage system with linear servo and HIWIN guide rail for precise movement.
- Feeding and receiving system with adjustable material box dimensions.
- Swing arm system with Yaskawa servo motor for stable operation.
- User-friendly Windows 7 operating system with Chinese interface.
Często zadawane pytania
- What is the die bonding position accuracy of this machine?The die bonding position accuracy is ±0.3 mil, ensuring high precision in semiconductor packaging.
- What type of operating system does this machine use?The machine uses a Windows 7 operating system with a Chinese interface, designed for easy and smooth operation.
- What is the resolution of the imaging system?The imaging system has a resolution of 0.5 um and features a 130w high-speed camera for precise image identification.
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